číslo produktu:155558
rezervujStress-Induced Phenomena in Metallization
Rok vydania: 2007
Vydavateľ: Springer
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O knihe:
All papers were peer reviewed. The conference was on reliability related science in ULSI interconnect, and the main purpose was to discuss the stress induced phenomena in the LSI interconnect among academic researchers and industry engineers to establish academic science and to improve the reliability of ULSI chips.
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