Olejar Books

Today's artificially intelligent systems are fabricated using sub-micron scale devices in micro and meso packages, primarily using electric signals and interfacing to the macroscopic level using the logic of programming. While packaging was once considered secondary, it has now developed its own standards throughout the world. This book discusses the three key features for next generation application specific systems-on-a-chip (SOC): Mixed Signals, Mixed Environmental Domains, and Varying Scales of Devices and Packaging Components. This book also addresses some of the non-traditional developments of MEMS and their applications.